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General
This system is designed to R&D purpose Bonding System suitable for MEMS, Sensors, SOI device etc. It can bond, with high accuracy, substrates on which similar / dissimilar materials deposited. Heating, pressing, substrate cleaning, and alignment can be performed under high vacuum environment.
Combing with our unique multi sputtering system, the system can make process from multi-layered deposited films to bonding procedure consistently under vacuum.
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- Maximum 4 inch wafer can be made at various kinds of bonding.
- Unique heating mechanism controls temperature precisely and achieves heating and cooling processes.
- Surface analysis function such as radical source and ion source can be attached.
- By integrating the system into a multi target sputtering system, multilayer films of metal and oxide can be achieved.
- Surface analysis chamber can be expanded as an option.
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