Japanese Specimen thickness continuously indicated on an alphanumeric display with an accuracy of one micron. Unique grinding rate control predetermines the rate at which material is to be removed. Produces either a dimple or an elongated slot for an increased area of electron beam transparency. 40X microscope for specimen positioning and in-place observation. Automatic shut-off when desired thickness is reached. Microprocessor-based control circuitry. The Model 2000 Specimen Prep System is a mechanical thinning instrument designed for total preparation needs. It quickly and consistently prepares high-quality TEM specimens. By simply changing tools, the Model 2000 can be utilized to cut sample materials,rough grind the specimen, and then finish grind the specimen to electron beam transparency. The Model 2000 provides the option of producing either a dimple or an elongated slot in the specimen. Dimpling involves rotating the specimen on the Y-axis and a grinding wheel on the X-axis, providing a specimen with a central area reduced to a thickness of a few microns. An elongated slot is a achieved by oscillating the specimen beneath the grinding wheel. For semi-conductors and composite materials, where analysis of interfaces is critical, exposing the entire interface provides a significantly larger area for analysis. Both dimpling and slotting use an abrasive slurry to reduce the specimen thickness to the point of electron beam transparency. By only thinning the central area of the specimen, a rugged outer rim remains, eliminating special handling techniques for fragile specimens. The Model 2000 produces high quality specimens with virtually no heat induced or mechanical distortion. Dimpling or slotting can be done to either one or both sides of the specimen. SPECIFICATIONS Size : 12.25"W×11.8"H×12.1"D Weight : 31 lbs. Input Voltage : 110VAC, 50/60 Hz or 220VAC, 50/60 Hz